AOS Thermal Compounds

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22 Meridian Road, Suite 6
Eatontown, NJ 07724-2278
About AOS Thermal Compounds
  • AOS Thermal Compounds developed the first non-silicone thermal grease for AT&T in the 1970's. Today we manufacture the most durable non-silicone thermal greases, Micro-Faze thermal pads (not phase change material) and Sure-Form one part gap fillers.
Competitors of AOS Thermal Compounds
  • DB LECTRO Inc

    ISO9001-2015 Authorized Distributor of Electronic and Electromechanical Components
  • Timtronics

    TIMTRONICS is a leading manufacturer of the most advanced Non-Silicone and Silicone Heat Sink Compounds, thermally conductive pads, gap fillers, liquid gap fillers, putties and epoxy/potting compounds to meet thermal, reliability and low cost requirements of high-end chipset, graphic processors...
  • Jumo Process Control, Inc.

    Experts in Measurement and Control!
Products by AOS Thermal Compounds
  • Micro-Faze® 3A4

    Micro-Faze® 3A4 is a unique non-silicone thermal pad that exhibits extremely low thermal resistance and was designed to replace phase change materials and even high performance thermal grease. The pad is composed of 1 mil films of high thermal conductivity, tacky, but dry-to-the-touch thermal... Read more
  • Sureform 52041

    High conductivity and most durable non-silicone gap fillers; pre-formed pads or dispense in place. Read more
  • Heat Sink Compounds

    AOS Heat Sink Compound: 52022 (AOS 300) AOS Heat Sink Compound: 52055 (AOS 340) AOS Heat Sink Compound: 52051 (WC HTC) AOS Heat Sink Compound: 52056 (HTC 35) AOS Heat Sink Compound: 52050 (HTC 80) AOS Heat Sink Compound: 52060 (HTC 100) AOS Heat Sink Compound: 52070 (HTC 140) AOS Heat... Read more