AOS Thermal Compounds

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22 Meridian Road, Suite 6
Eatontown, NJ 07724-2278
About AOS Thermal Compounds
  • AOS Thermal Compounds developed the first non-silicone thermal grease for AT&T in the 1970's. Today we manufacture the most durable non-silicone thermal greases, Micro-Faze thermal pads (not phase change material) and Sure-Form one part gap fillers.
Competitors of AOS Thermal Compounds
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    Fujipoly is a manufacturer of two distinct product lines. Sarcon(r) Thermal Interface Materials are used to help keep sensitive components cool by eliminating the air gap between the component and the heat sink. The Zebra(r) Elastomeric Connectors are used in between PCB to PCB or LCD to PCB...
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Products by AOS Thermal Compounds
  • Micro-Faze® 3A4

    Micro-Faze® 3A4 is a unique non-silicone thermal pad that exhibits extremely low thermal resistance and was designed to replace phase change materials and even high performance thermal grease. The pad is composed of 1 mil films of high thermal conductivity, tacky, but dry-to-the-touch thermal... Read more
  • Sureform 52041

    High conductivity and most durable non-silicone gap fillers; pre-formed pads or dispense in place. Read more
  • Heat Sink Compounds

    AOS Heat Sink Compound: 52022 (AOS 300) AOS Heat Sink Compound: 52055 (AOS 340) AOS Heat Sink Compound: 52051 (WC HTC) AOS Heat Sink Compound: 52056 (HTC 35) AOS Heat Sink Compound: 52050 (HTC 80) AOS Heat Sink Compound: 52060 (HTC 100) AOS Heat Sink Compound: 52070 (HTC 140) AOS Heat... Read more