TIMTRONICS is a leading manufacturer of the most advanced Non-Silicone and Silicone Heat Sink Compounds, thermally conductive pads, gap fillers, liquid gap fillers, putties and epoxy/potting compounds to meet thermal, reliability and low cost requirements of high-end chipset, graphic processors trend ever-faster clock speeds with distribution worldwide. Unique formulations include High Thermal Conductivity up to 14 w/mk, High Temperature up to 360*C, Food Grade Thermal Grease and Electrically Conductive Compounds. TIMTRONICS also custom formulates for specific design applications.
Fujipoly is a manufacturer of two distinct product lines. Sarcon(r) Thermal Interface Materials are used to help keep sensitive components cool by eliminating the air gap between the component and the heat sink. The Zebra(r) Elastomeric Connectors are used in between PCB to PCB or LCD to PCB...
ZIRCAR Refractory Composites, Inc., produces a comprehensive line of advanced high performance ceramic-ceramic composite materials and related products. Our materials are used around the world in the most demanding thermal, structural and electrical insulating applications ranging in...
