Substrate Materials (9 companies found)

Compare and research Substrate Materials companies and businesses online.

  • Graphenol Heat Spreader Foil: Graphenol is a new TIM heat spreader foil that offers a handling friendly approach packaged with an ultra-high in-plane thermal conductivity of 1,500 W/m-K. Graphenol is designed to eliminate the traditional handling issues that exist within current pyrolitc heat spreading graphite foils such...
  • Headquartered in Gardena, California, Segue Electronics is an Original Equipment Manufacturer (OEM) for the electronics industries. For more than 30 years Segue has efficiently met the requirements of many satisfied customers for a subcontractor with outstanding product reliability and cost...
  • Materion Performance Alloys is a world leader, supplying high-performance alloys that enhance its customers' technologies.The company offers a variety of MoldMAX alloys to meet the high production demands of the plastic processing industry. These alloys provide a unique combination of strength,...
  • IRC Inc. is a leading international manufacturer of advanced film, metal glaze and wirewound resistive products with facilities in Corpus Christi, Texas, Boone, N.C., Smithfield, N.C., and Barbados. IRC is part of TT electronics plc, a global electronics company manufacturing a broad range of...
  • The Bergquist Company is the world leader in thermal management materials, supplying top electronic OEMs around the world with the best-known brands in the business. Sil-Pad®, Gap Pad®, Gap Fillers, Bond-Ply® and Hi-Flow® materials cover all of your thermal interface needs. Bergquist’s metal...
  • alfatec. For 25 years, with a view to the future. Since the foundation of our company in 1978 it is our first aim to offer future-oriented technologies and highly modern logistical conceptions. Within this goal, our customer is and will always be in the focus of interest. See website for more...
  • Thermal interface materials. Give power devices soldered-on reliability with any heat sink. High thermal transfer, with no attachment hardware.