Bonded fin

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A bonded fin heat sink are normally used is forced air circulation envoirement as there is no limitation on fin height to fin space ratio. SNS cooling technology offer bonded fin products with ratio as high as 40:1. SNS uses following methods to bond the fin & base

* Aluminum filled high Thermally Conductive Epoxy (ROHS compliant) as per following temperature rating.
o low temperature resistance epoxy-max working temperature of 175 °0F
o High temperature resistance epoxy-max 450 °0F
* Low temperature soldering material (ROHS compliant)
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