PowerElectronics_1.4.19

HYAMP III is a manual Ground Bond tester that features an enhanced graphic LCD. It consists of three models. The 3130 provides 30 Amps of Ground Bond test current, the 3140 provides 40 Amps of Ground Bond test current and the 3160 provides 60 Amps of Ground Bond test current. All models can be used stand alone or interconnected to the Hypot® III family of Hipot testers to form a complete test system. They can also be controlled through enhanced PLC Remote Control.

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